Tous les livres numériques de John H. Lau en PDF et EPUB

6 Livre(s)
Télécharger le livre : Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice.This is achieved...

Editeur : Springer
Parution : 2024-05-23
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179,34 €
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Télécharger le livre : Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by...

Editeur : Springer
Parution : 2023-03-27
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137,14 €
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Télécharger le livre : Semiconductor Advanced Packaging
Semiconductor Advanced Packaging
John H. Lau
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved...

Editeur : Springer
Parution : 2021-05-17
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126,59 €
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Télécharger le livre : Assembly and Reliability of Lead-Free Solder Joints
Assembly and Reliability of Lead-Free Solder Joints
John H. Lau , Ning-Cheng Lee , Ning-Cheng Lee
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter.This is achieved by providing in-depth studies on a number of major topics such as solder...

Editeur : Springer
Parution : 2020-05-29
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116,04 €
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Télécharger le livre : Heterogeneous Integrations
Heterogeneous Integrations
John H. Lau
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components...

Editeur : Springer
Parution : 2019-04-03
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158,24 €
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Télécharger le livre : Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
John H. Lau
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for...

Editeur : Springer
Parution : 2018-04-05
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105,49 €
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