Téléchargez le livre : Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging



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Éditeur :

Springer


Paru le : 2023-03-27



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Description
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Pages
525 pages
Collection
n.c
Parution
2023-03-27
Marque
Springer
EAN papier
9789811999161
EAN PDF
9789811999178
Informations sur l'ebook
Nombre pages copiables
5
Nombre pages imprimables
52
Taille du fichier
31130 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
137,14 €
EAN EPUB
9789811999178
Informations sur l'ebook
Nombre pages copiables
5
Nombre pages imprimables
52
Taille du fichier
324096 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
137,14 €
For Internal Use Only:

John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow

Unimicron Technology Corporation, John_Lau@unimicron.com

 

SPECIALIZED PROFESSIONAL COMPETENCIES

[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.

[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.

[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.

Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.

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