Tous les livres numériques de C.P. Wong en PDF et EPUB

6 Livre(s)
Télécharger le livre : Materials for Advanced Packaging
Materials for Advanced Packaging
Daniel Lu , C.P. Wong
This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in...

Editeur : Springer
Parution : 2016-11-18
PDF, ePub

220,49 €
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Télécharger le livre : Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Yi-Shao Lai , Ho-Ming Tong , C.P. Wong
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive...

Editeur : Springer
Parution : 2013-03-20
ePub

147,69 €
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Télécharger le livre : Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Yi (Grace) Li , Kyoung-Sik Moon , C.P. Wong
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses...

Editeur : Springer
Parution : 2009-12-23
ePub

241,59 €
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Télécharger le livre : Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Yi (Grace) Li , Daniel Lu , C.P. Wong
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented...

Editeur : Springer
Parution : 2009-10-08
ePub

168,79 €
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Télécharger le livre : Materials for Advanced Packaging
Materials for Advanced Packaging
Daniel Lu , C.P. Wong
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry,...

Editeur : Springer
Parution : 2008-12-17
ePub

179,34 €
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Télécharger le livre : Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Feuilleter
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Y.C. Lee , Ephraim Suhir , C.P. Wong
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics,...

Editeur : Springer
Parution : 2007-05-26
PDF

515,89 €
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