Téléchargez le livre : Materials for Advanced Packaging

Materials for Advanced Packaging



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Éditeur :

Springer


Paru le : 2016-11-18



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Description

This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
Pages
969 pages
Collection
n.c
Parution
2016-11-18
Marque
Springer
EAN papier
9783319450971
EAN PDF
9783319450988
Informations sur l'ebook
Nombre pages copiables
9
Nombre pages imprimables
96
Taille du fichier
44646 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
220,49 €
EAN EPUB
9783319450988
Informations sur l'ebook
Nombre pages copiables
9
Nombre pages imprimables
96
Taille du fichier
29512 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
220,49 €

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