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Télécharger le livre : Designing TSVs for 3D Integrated Circuits
Soha Hassoun , Nauman Khan
Designing TSVs for 3D Integrated Circuits
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar...
Editeur : Springer
Parution : 2012-09-22
Collection : SpringerBriefs in Electrical and Computer Engineering
Format(s) : ePub
52,74 €
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