Téléchargez le livre : Designing TSVs for 3D Integrated Circuits

Designing TSVs for 3D Integrated Circuits

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Éditeur :

Springer


Collection :

SpringerBriefs in Electrical and Computer Engineering

Paru le : 2012-09-22

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Description
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks.  Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a ?oorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.
Pages
76 pages
Collection
SpringerBriefs in Electrical and Computer Engineering
Parution
2012-09-22
Marque
Springer
EAN papier
9781461455073
EAN EPUB
9781461455080
Informations sur l'ebook
Nombre pages copiables
0
Nombre pages imprimables
7
Taille du fichier
4946 Ko
Prix
52,74 €

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