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Dr. Tingyu Lin is a technical Director of National Centre for Advanced Packaging (NCAP), China. He has more than 20-year experiences in design, process, assembly, reliability and equipment development in electronics packaging, semiconductor, consumer electronics, thermal and aerospace industry. Before joining NCAP, he was a Motorola (Google) certified Six Sigma Black Belt in 2012. From 2012-2013, he was a program director of Institute of Microelectronics, Singapore (IME), and responsible for
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Téléchargez le livre : Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Faxing Che , Tingyu Lin , Hengyun Zhang , Wensheng Zhao

Woodhead Publishing

2019-11-14

epub sans DRM

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including...

216,27 €

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