Dr. Liao Ling is an Intel Fellow and chief architect of photonic integration in Intel’s Silicon Photonics Product Division. She joined Intel in 1997 and spearheaded research in high-speed silicon modulation, optical transmitter integration, and co-packaged optics. She currently leads the development of multi terabit per second photonic engines to be co-packaged with switch SOCs and XPUs for future power, cost, and bandwidth density scaling. Ling earned her B.S. and M.S. in materials science and engineering from the Massachusetts Institute of Technology and Ph.D. in electrical engineering from the University of Surrey in the UK.