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Biographie et livres de David A. Dillard

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David A. Dillard is Adhesive and Sealant Science Professor, in the Biomedical Engineering and Mechanics Department at Virginia Polytechnic Institute and State University, USA. He has worked extensively in the field of adhesive bonding, having experience in structural adhesives for aerospace, automotive, and infrastructure applications, adhesives and coatings for microelectronic applications, pressure sensitive adhesives, elastomeric adhesives and sealants, and polymeric membranes. Prof. Dillard
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Téléchargez le livre :  Advances in Structural Adhesive Bonding
Advances in Structural Adhesive Bonding

David A. Dillard


Woodhead Publishing

2023-06-10

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Advances in Structural Adhesive Bonding, Second Edition reviews developments in adhesive bonding for a range of advanced structural engineering applications. This new edition has been fully revised to include the latest advances in materials, testing...

321,77

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Télécharger le livre :  Testing Adhesive Joints
Joining techniques such as welding, brazing, riveting and screwing are used by industry all over the world on a daily basis. A further method of joining has also proven to be highly successful: adhesive bonding. Adhesive bonding technology has an extremely broad range...

Editeur : Wiley-VCH
Parution : 2013-03-25
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131,14

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Télécharger le livre :  Advances in Structural Adhesive Bonding
Adhesive bonding is often effective, efficient, and often necessary way to join mechanical structures. This important book reviews the most recent improvements in adhesive bonding and their wide-ranging potential in structural engineering.Part one reviews advances in...

Editeur : Woodhead Publishing
Parution : 2010-03-31
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242,65

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Télécharger le livre :  Adhesion Science and Engineering
The Mechanics of Adhesion shows that adhesion science and technology is inherently an interdisciplinary field, requiring fundamental understanding of mechanics, surfaces, and materials. This volume comprises 19 chapters. Starting with a background and introduction to...

Editeur : Elsevier Science
Parution : 2002-11-14
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643,55

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