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Télécharger le livre : Wafer Level 3-D ICs Process Technology
Ronald J. Gutmann , L. Rafael Reif , Chuan Seng Tan
Wafer Level 3-D ICs Process Technology
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system...
Editeur : Springer
Parution : 2009-06-29
Collection : Integrated Circuits and Systems
Format(s) : ePub
142,93 €
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