RF and Microwave Microelectronics Packaging II



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Springer


Paru le : 2017-03-09



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Description

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Pages
172 pages
Collection
n.c
Parution
2017-03-09
Marque
Springer
EAN papier
9783319516967
EAN PDF
9783319516974

Informations sur l'ebook
Nombre pages copiables
1
Nombre pages imprimables
17
Taille du fichier
6431 Ko
Prix
126,59 €
EAN EPUB
9783319516974

Informations sur l'ebook
Nombre pages copiables
1
Nombre pages imprimables
17
Taille du fichier
3727 Ko
Prix
126,59 €

Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Companies in America and rank #2 in San Diego Business Journal 100 Fastest Growing Private Companies in San Diego. Kuang was three times the finalist for the Most Admired CEO in San Diego. 

Rick Sturdivant has been President of Microwave Packaging Technology, Inc. (MPT) since 2003. He regularly presents at conference workshops and other venues, and has been a guest lecturer at Georgia Tech Research Institute. He is a recognized expert in the field of Transmit/Receive (T/R) modules for phased array radar and communication systems.

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