Télécharger le livre :  Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of...

Editeur : Woodhead Publishing
Parution : 2015-05-23
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