Téléchargez le livre : SiP System-in-Package Design and Simulation

SiP System-in-Package Design and Simulation

Mentor EE Flow Advanced Design Guide

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Éditeur :

Wiley


Paru le : 2017-07-14



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Description

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow
Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. 
Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:   Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform
Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. 
Pages
472 pages
Collection
n.c
Parution
2017-07-14
Marque
Wiley
EAN papier
9781119045939
EAN PDF
9781119046011
Informations sur l'ebook
Nombre pages copiables
0
Nombre pages imprimables
472
Taille du fichier
87296 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
144,48 €
EAN EPUB
9781119046004
Informations sur l'ebook
Nombre pages copiables
0
Nombre pages imprimables
472
Taille du fichier
97423 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
144,48 €

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