Téléchargez le livre : Solder Joint Technology

Solder Joint Technology

Materials, Properties, and Reliability

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Éditeur :

Springer


Collection :

Springer Series in Materials Science

Paru le : 2007-07-27



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Description
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
Pages
370 pages
Collection
Springer Series in Materials Science
Parution
2007-07-27
Marque
Springer
EAN papier
9780387388908
EAN PDF
9780387388922
Informations sur l'ebook
Nombre pages copiables
3
Nombre pages imprimables
37
Taille du fichier
12708 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
220,49 €

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