Recent Progress in Lead-Free Solder Technology

Materials Development, Processing and Performances de

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Éditeur :

Springer


Collection :

Topics in Mining, Metallurgy and Materials Engineering

Paru le : 2022-03-01

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Description
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying.  The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Pages
328 pages
Collection
Topics in Mining, Metallurgy and Materials Engineering
Parution
2022-03-01
Marque
Springer
EAN papier
9783030934408
EAN PDF
9783030934415

Informations sur l'ebook
Nombre pages copiables
3
Nombre pages imprimables
32
Taille du fichier
11950 Ko
Prix
179,34 €
EAN EPUB
9783030934415

Informations sur l'ebook
Nombre pages copiables
3
Nombre pages imprimables
32
Taille du fichier
102953 Ko
Prix
179,34 €