Téléchargez le livre : Reflow Soldering

Reflow Soldering

Apparatus and Heat Transfer Processes

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Elsevier


Paru le : 2020-07-02



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Description
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. - Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles - Analyses and compares the different reflow ovens - Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality - Introduces Vapor Phase Soldering (VPS) technology
Pages
294 pages
Collection
n.c
Parution
2020-07-02
Marque
Elsevier
EAN papier
9780128185056
EAN PDF
9780128185063
Informations sur l'ebook
Nombre pages copiables
29
Nombre pages imprimables
29
Taille du fichier
18012 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
174,07 €
EAN EPUB SANS DRM
9780128185063
Informations sur l'ebook
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
174,07 €
Dr. habil. Illés Balázs received his Ph.D. degree in electrical engineering from Budapest University of Technology and Economics. He has been involved in convection and vapour phase soldering technologies, reliability of solder joints and numerical simulations. He is the author of 47 journal papers and more than 50 conference papers.Dr. Olivér Krammer, Phd: received his Ph.D. degree in electrical engineering from Budapest University of Technology and Economics. He has been involved in surface mounting technology, soldering technologies, reliability of joining technologies, solder profiling. He is the author of 25 journal papers and more than 50 conference papers.Dr. Attila Géczy, Phd: received his Ph.D. degree in electrical engineering from Budapest University of Technology and Economics. He has been involved in vapour phase soldering technology, measurement technologies and numerical simulations. He is the author of 23 journal papers and more than 40 conference papers.

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