Téléchargez le livre : Electromigration Modeling at Circuit Layout Level

Electromigration Modeling at Circuit Layout Level

de

,

Éditeur :

Springer


Collection :

SpringerBriefs in Applied Sciences and Technology

Paru le : 2013-03-16

eBook Téléchargement , DRM LCP 🛈 DRM Adobe 🛈
Lecture en ligne (streaming)
52,99 €
Téléchargement immédiat
Dès validation de votre commande
Image Louise Reader présentation

Louise Reader

Lisez ce titre sur l'application Louise Reader.

badge apple Application Louise Reader
badge Android Application Louise Reader
Description
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Pages
103 pages
Collection
SpringerBriefs in Applied Sciences and Technology
Parution
2013-03-16
Marque
Springer
EAN papier
9789814451208
EAN EPUB
9789814451215
Informations sur l'ebook
Nombre pages copiables
1
Nombre pages imprimables
10
Taille du fichier
3963 Ko
Prix
52,99 €

Suggestions personnalisées